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Selective silicide or boride film formation by reaction of vapor phase TiCl sub 4 with silicon or boron

Journal Article · · Journal of the Electrochemical Society; (USA)
OSTI ID:6448913
 [1]; ;  [2]
  1. Dept. of Chemistry, Ohio State Univ., Columbus, OH (US)
  2. AT and T Bell Lab., Murray Hill, NJ (US)

Methods for selectively forming titanium silicide and titanium boride by vapor phase reaction of titanium chloride precursors with silicon or boron substrate surfaces are examined. By passing TiCl{sub 4} through a heated chamber packed with titanium metal turnings within the reactor tube, a reduced titanium halide is generated. It was found that the silicide or boride formation in the reactor can thus be controlled at a much lower temperature. Also, excessive silicon erosion normally encountered at the higher operating temperature (> 775{degrees}C) required for the direct TiCl{sub 4} reaction is minimized. Characterization of the resulting films was conducted by use of scanning and transmission electron microscopy, sheet resistance measurements, and x-ray diffraction.

OSTI ID:
6448913
Journal Information:
Journal of the Electrochemical Society; (USA), Journal Name: Journal of the Electrochemical Society; (USA) Vol. 137:5; ISSN 0013-4651; ISSN JESOA
Country of Publication:
United States
Language:
English