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Title: Apparatus for precision micromachining with lasers

Abstract

A new material processing apparatus using a short-pulsed, high-repetition-rate visible laser for precision micromachining utilizes a near diffraction limited laser, a high-speed precision two-axis tilt-mirror for steering the laser beam, an optical system for either focusing or imaging the laser beam on the part, and a part holder that may consist of a cover plate and a back plate. The system is generally useful for precision drilling, cutting, milling and polishing of metals and ceramics, and has broad application in manufacturing precision components. Precision machining has been demonstrated through percussion drilling and trepanning using this system. With a 30 W copper vapor laser running at multi-kHz pulse repetition frequency, straight parallel holes with size varying from 500 microns to less than 25 microns and with aspect ratios up to 1:40 have been consistently drilled with good surface finish on a variety of metals. Micromilling and microdrilling on ceramics using a 250 W copper vapor laser have also been demonstrated with good results. Materialographic sections of machined parts show little (submicron scale) recast layer and heat affected zone. 1 fig.

Inventors:
; ;
Publication Date:
Research Org.:
Univ. of California (United States)
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
644426
Patent Number(s):
US 5,744,780/A/
Application Number:
PAN: 8-523,321
Assignee:
Dept. of Energy, Washington, DC (United States)
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 28 Apr 1998
Country of Publication:
United States
Language:
English
Subject:
32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION; 36 MATERIALS SCIENCE; VISIBLE RADIATION; LASER BEAM MACHINING; MINIATURIZATION; OPTICAL SYSTEMS; BEAM OPTICS; METALS; CERAMICS; LASER DRILLING; METAL VAPOR LASERS

Citation Formats

Chang, J J, Dragon, E P, and Warner, B E. Apparatus for precision micromachining with lasers. United States: N. p., 1998. Web.
Chang, J J, Dragon, E P, & Warner, B E. Apparatus for precision micromachining with lasers. United States.
Chang, J J, Dragon, E P, and Warner, B E. Tue . "Apparatus for precision micromachining with lasers". United States.
@article{osti_644426,
title = {Apparatus for precision micromachining with lasers},
author = {Chang, J J and Dragon, E P and Warner, B E},
abstractNote = {A new material processing apparatus using a short-pulsed, high-repetition-rate visible laser for precision micromachining utilizes a near diffraction limited laser, a high-speed precision two-axis tilt-mirror for steering the laser beam, an optical system for either focusing or imaging the laser beam on the part, and a part holder that may consist of a cover plate and a back plate. The system is generally useful for precision drilling, cutting, milling and polishing of metals and ceramics, and has broad application in manufacturing precision components. Precision machining has been demonstrated through percussion drilling and trepanning using this system. With a 30 W copper vapor laser running at multi-kHz pulse repetition frequency, straight parallel holes with size varying from 500 microns to less than 25 microns and with aspect ratios up to 1:40 have been consistently drilled with good surface finish on a variety of metals. Micromilling and microdrilling on ceramics using a 250 W copper vapor laser have also been demonstrated with good results. Materialographic sections of machined parts show little (submicron scale) recast layer and heat affected zone. 1 fig.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1998},
month = {4}
}