Apparatus for precision micromachining with lasers

Patent · Tue Apr 28 04:00:00 EDT 1998

OSTI ID:644426

Chang, J J; Dragon, E P; Warner, B E

A new material processing apparatus using a short-pulsed, high-repetition-rate visible laser for precision micromachining utilizes a near diffraction limited laser, a high-speed precision two-axis tilt-mirror for steering the laser beam, an optical system for either focusing or imaging the laser beam on the part, and a part holder that may consist of a cover plate and a back plate. The system is generally useful for precision drilling, cutting, milling and polishing of metals and ceramics, and has broad application in manufacturing precision components. Precision machining has been demonstrated through percussion drilling and trepanning using this system. With a 30 W copper vapor laser running at multi-kHz pulse repetition frequency, straight parallel holes with size varying from 500 microns to less than 25 microns and with aspect ratios up to 1:40 have been consistently drilled with good surface finish on a variety of metals. Micromilling and microdrilling on ceramics using a 250 W copper vapor laser have also been demonstrated with good results. Materialographic sections of machined parts show little (submicron scale) recast layer and heat affected zone. 1 fig.

• Research Organization: University of California
• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: W-7405-ENG-48
• Assignee: Dept. of Energy, Washington, DC (United States)
• Patent Number(s): US 5,744,780/A/
• Application Number: PAN: 8-523,321
• OSTI ID: 644426
• Country of Publication: United States
• Language: English

Related Subjects

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION
36 MATERIALS SCIENCE
BEAM OPTICS
CERAMICS
LASER BEAM MACHINING
LASER DRILLING
METAL VAPOR LASERS
METALS
MINIATURIZATION
OPTICAL SYSTEMS
VISIBLE RADIATION