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Nitrogen and fluorine ion implantation in In{sub {ital x}}Ga{sub 1{minus}{ital x}}N

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.114271· OSTI ID:64321
 [1]; ; ;  [2]
  1. Sandia National Laboratories, Albuquerque, New Mexico 87185-0603 (United States)
  2. University of Florida, Gainesville, Florida 32611 (United States)
Implantation of N{sup +} ions in {ital n}-type In{sub {ital x}}Ga{sub 1{minus}{ital x}}N (0.37{le}x{le}1.0) produces maximum increases in sheet resistance of 50--100 times upon annealing in the range of 400--600 {degree}C. The dominant deep state introduced by implantation and annealing have ionization energies of {similar_to}0.35--0.39 eV and therefore are relatively high in the band gap of the InGaN. There was no evidence for chemical deep levels associated with the implanted N{sup +} or F{sup +}. The implant isolation behavior of {ital n}-type InGaN appears analogous to that of InP and InGaAs. {copyright} {ital 1995} {ital American} {ital Institute} {ital of} {ital Physics}.
Research Organization:
Sandia National Laboratory
DOE Contract Number:
AC04-94AL85000
OSTI ID:
64321
Journal Information:
Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 22 Vol. 66; ISSN APPLAB; ISSN 0003-6951
Country of Publication:
United States
Language:
English

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