Chemical characterization of a polyphosphoric acid etchant

Technical Report · Fri Dec 01 04:00:00 EST 1978

DOI:https://doi.org/10.2172/6387382· OSTI ID:6387382

Morin, T J

Sensitivity of an orthophosphoric acid, a polyphosphoric acid, and an iron (III) chloride etchant to variations in process conditions was examined to determine the potential production application of the etchant system in the photolithographic fabrication of pure aluminum circuits. The effects of changes in temperature, orthophosphoric acid concentration, polyphosphoric acid concentration, iron (III) chloride concentration and dissolved aluminum concentration on etched circuit quality and etch rate were examined. The etchant system allows reasonable variation in preparation and circuit processing without drastically affecting the etched circuit quality. Control of the etchant can be maintained over a broad range of temperatures and compositions. 14 figures, 1 table.

• Research Organization: Bendix Corp., Kansas City, MO (USA)
• DOE Contract Number: EY-76-C-04-0613
• OSTI ID: 6387382
• Report Number(s): BDX-613-2078(Rev.)
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360101 -- Metals & Alloys-- Preparation & Fabrication
42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
ALUMINIUM
CHEMICAL COMPOSITION
CHEMICAL REACTION KINETICS
CHLORIDES
CHLORINE COMPOUNDS
DISPERSIONS
ELECTRONIC CIRCUITS
ELEMENTS
ETCHING
FABRICATION
FILMS
HALIDES
HALOGEN COMPOUNDS
HYDROGEN COMPOUNDS
INORGANIC ACIDS
IRON CHLORIDES
IRON COMPOUNDS
KINETICS
METALS
MICROELECTRONIC CIRCUITS
MIXTURES
PHOSPHORIC ACID
POLYMERS
QUANTITY RATIO
REACTION KINETICS
SURFACE FINISHING
TEMPERATURE DEPENDENCE
TRANSITION ELEMENT COMPOUNDS