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U.S. Department of Energy
Office of Scientific and Technical Information

Devices comprised of discrete high-temperature superconductor chips disposed on a surface

Patent ·
OSTI ID:6380573
A structure exposed to electromagnetic radiation is described, comprising: a metal surface and a plurality of discrete elements, each element including an insulating substrate and a high-temperature superconducting material substantially covering a face of said substrate, a portion of said metal surface being substantially covered with said elements with said superconducting material thereof adjacent to and in electrical contact with said metal surface, thereby reducing ohmic losses on exposure of said structure to said electromagnetic radiation.
Assignee:
University of California, Berkeley, Oakland, CA (United States)
Patent Number(s):
A; US 5215959
Application Number:
PPN: US 7-885926
OSTI ID:
6380573
Country of Publication:
United States
Language:
English