Thermal tests of MC3811 rigid/flex printed wiring boards

Technical Report · Mon Oct 01 04:00:00 EDT 1990

DOI:https://doi.org/10.2172/6330246· OSTI ID:6330246

Gentry, F L

Rigid/flex multilayer printed wiring boards are more sensitive to thermal environmental changes than conventional printed wiring boards. This is manifested because of a composition of dissimilar materials used within the construction of this type of product. During fabrication and assembly, stresses can develop within the plated-through holes from differences in thermal properties of the rigid and flexible materials, primarily thermal coefficient of expansion. Thermal shock and thermal stress tests and rework simulation as defined in MIL-P-50884 have been performed in this study as indicators of processing quality to detect faults and to verify improvements in board reliability. 3 refs., 17 figs., 3 tabs.

• Research Organization: Sandia National Labs., Albuquerque, NM (USA)
• Sponsoring Organization: DOE/DP
• DOE Contract Number: AC04-76DP00789
• OSTI ID: 6330246
• Report Number(s): SAND-88-0712; ON: DE91006431
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
426000* -- Engineering-- Components
Electron Devices & Circuits-- (1990-)
COMPOSITE MATERIALS
CRACKS
ELECTRONIC CIRCUITS
MATERIALS
MATERIALS TESTING
NONDESTRUCTIVE TESTING
PHYSICAL PROPERTIES
PRINTED CIRCUITS
RELIABILITY
STRESSES
TESTING
THERMAL ANALYSIS
THERMAL SHOCK
THERMAL STRESSES
THERMAL TESTING
THERMODYNAMIC PROPERTIES