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U.S. Department of Energy
Office of Scientific and Technical Information

Method and apparatus for interconnecting processors in a hyper-dimensional array

Patent ·
OSTI ID:6215322
This patent describes a parallel processor having an array of integrated circuits, each being addressed by a multibit binary address and comprising at least one processor and being interconnected to each of its nearest neighbors in a pattern of a Boolean cube of more than three dimensions, apparatus for interconnecting the integrated circuits on boards and backplanes comprising: means for interconnecting on each circuit board the integrated circuits which are nearest neighbors in dimensions one through L; means for interconnecting on each backplane the integrated circuits which are nearest neighbors in dimensions L+1 through M; means for interconnecting from one backplane to another the integrated circuits which are nearest neighbors in dimensions M+1 through N; and means for adjusting the clock cycle during the routing of messages between processors in accordance with the dimension of the processors between which the message is being routed.
Assignee:
Thinking Machines Corp., Cambridge, MA
Patent Number(s):
US 4805091
OSTI ID:
6215322
Country of Publication:
United States
Language:
English