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A non-noble front metallization process using Mo/Sn screen printed pastes

Conference · · Proc. - Electrochem. Soc.; (United States)
OSTI ID:6204774
This paper describes a front metallization process using an inexpensive Mo/Sn screen printed paste. The paste is first fired in air to burn off the organic vehicle, then fired in a reducing atmosphere to create ohmic contact between the silicon and Mo/Sn powder. A conductive AR coating (ITO) is used to reduce the inherent series resistance of the system. Cells have been produced with efficiency identical to that of silver paste controls.
Research Organization:
Spectrolab Inc., Sylmar, CA
OSTI ID:
6204774
Report Number(s):
CONF-8305161-
Conference Information:
Journal Name: Proc. - Electrochem. Soc.; (United States) Journal Volume: 83-11
Country of Publication:
United States
Language:
English