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Nonnoble front metallization process

Technical Report ·
OSTI ID:5840593
The optimization, evaluation and demonstration of a novel metallization system is presented. The Mo/Sn/TiH system and the ITO conductive AR systems are discussed. It is concluded that Mo/Sn has adequate conductivity for screen printing, shunting is never a problem solderability is a major problem, more work is needed on wetting phenomena, and cellulosic vehicle is the best. It is shown that various additives are unsuccessful on improving adhesive and that tin does not wet the system at low temperature.
Research Organization:
Spectrolab, Inc., Sylmar, CA (USA)
OSTI ID:
5840593
Report Number(s):
N-85-15279
Country of Publication:
United States
Language:
English

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Related Subjects

36 MATERIALS SCIENCE
360104* -- Metals & Alloys-- Physical Properties
ALLOYS
FABRICATION
HYDRIDES
HYDROGEN COMPOUNDS
MECHANICAL PROPERTIES
MOLYBDENUM ALLOYS
OPTIMIZATION
PHYSICAL PROPERTIES
TEMPERATURE DEPENDENCE
TIN ALLOYS
TITANIUM COMPOUNDS
TITANIUM HYDRIDES
TRANSITION ELEMENT COMPOUNDS
WETTABILITY