Atomic-scale simulation of adhesion between metallic surfaces
We have performed MD simulations of adhesive phenomena, on an atomic scale, between metals possessing both smooth and stepped-surfaces. Studies of adhesion between identical metals, consisting of either Au, Cu, or Ni, with (001) or (111) orientations, reveal the existence of adhesive avalanches as the bodies are brought to within a critical separation ({approximately}2 {angstrom}). That is, as the surfaces approach one another, one or both surface layers becomes unstable, and abruptly moves toward the other. This signals a transition from an initial system with two distinct surfaces to one possessing no identifiable surfaces. The presence of adhesive avalanches will pose difficulties in determining adhesive forces and energies by means of atomic force microscopy at sub-nanometer separations of probe tip and sample surface. 7 refs., 3 figs.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (USA)
- Sponsoring Organization:
- DOE/DP
- DOE Contract Number:
- AC04-76DP00789
- OSTI ID:
- 6200796
- Report Number(s):
- SAND-90-3057C; CONF-901105--29; ON: DE91004722
- Country of Publication:
- United States
- Language:
- English
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