Wave motion resulting from adhesive avalanche between metallic surfaces
- Sandia National Laboratories, Albuquerque, New Mexico 87185 (United States)
Atomistic simulations of impacting copper surfaces were performed using a many-body potential defined by the embedded-atom method. In the course of impact, as the impact surfaces approach each other, an adhesive avalanche occurs. That is, at a separation of roughly 2 A beyond the bulk interplanar spacing, one or both surface layers becomes unstable and abruptly moves towards the other. The adhesive avalanche signals a transition from an initial system with two distinct surfaces (at the impact interface) to one possessing no identifiable surfaces. This motion generates a brief ({lt}1 psec) but strong (10 GPa) tensile wave ahead of a compressive shock wave, which propagate away from the interface into the bulk. The tensile wave appears at impact velocities as low as 10 m/sec. Similar dynamic effects appear in a broad range of materials, and indeed may be of fundamental importance in phenomena underlying adhesion, friction, and wear.
- OSTI ID:
- 5430470
- Journal Information:
- Physical Review, B: Condensed Matter; (United States), Journal Name: Physical Review, B: Condensed Matter; (United States) Vol. 44:23; ISSN PRBMD; ISSN 0163-1829
- Country of Publication:
- United States
- Language:
- English
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