Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Transfer of F/sup -/ in the reaction of SF/sup -/ with SOF/sub 4/: implications for SOF/sub 4/ production in corona discharges

Journal Article · · Plasma Chem. Plasma Process.; (United States)
DOI:https://doi.org/10.1007/BF01016159· OSTI ID:6180181
The temperature (T) and electric field-to-gas pressure (E/P) dependences of the rate coefficient k for the reaction SF/sub 6//sup -/ + SOF/sub 4/ ..-->.. SOF/sub 5//sup -/ + SF/sub 5/ have been measured. For T < 270 K, k approaches a constant of 2.1 x 10/sup -9/ cm/sup 3//s, and for 433 > T > 270 K, k decreases with T according to k (cm/sup 3//s) = 0.124 exp (-3.3 ln T(K)). For E/P < V/cm x torr, k has a constant value of about 2.5 x 10/sup -19/ cm/sup 3//s, and for 130V/cm x torr > E/P > 60 V/cm x torr, the rate is approximately given by k (cm/sup 3//s) approx. 7.0 x 10/sup -10/ exp (-0.022E/P). The measured rate coefficient is used to estimate the influence of this reaction on SOF/sub 4/ production from negative, point-plane, glow-type corona discharges in gas mixtures containing SF/sub 6/ and at least trace amounts of O/sub 2/ and H/sub 2/O. A chemical kinetics model of the ion-drift region in the discharge gap is used to fit experimental data on SOF/sub 4/ loss mechanism. It is found that the contribution of this reaction to SOF/sub 4/ destruction falls considerably below the estimated maximum effect assuming that SF/sub 6//sup -/ is the predominant charge carrier which reacts only with SOF/sub 4/. The results of this analysis suggest that SF/sub 6//sup -/ is efficiently deactivated by other reactions, and the influence of SF/sub 6//sup -/ + SOF/sub 4/ on SOF/sub 4/ production is not necessarily more significant than that of other slower secondary processes such as gas-phase hydrolysis.
Research Organization:
National Bureau of Standards, Gaithersburg, MD (USA)
OSTI ID:
6180181
Journal Information:
Plasma Chem. Plasma Process.; (United States), Journal Name: Plasma Chem. Plasma Process.; (United States) Vol. 8:2; ISSN PCPPD
Country of Publication:
United States
Language:
English