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Heteroepitaxial silicon growth on polycrystalline MoSi/sub 2/

Journal Article · · J. Appl. Phys.; (United States)
DOI:https://doi.org/10.1063/1.329447· OSTI ID:6128490

Heteroepitaxial silicon was grown on polycrystalline MoSi/sub 2/ by electron beam evaporation at 800 /sup 0/C in an ultrahigh vacuum. The silicon films with a thickness between 2 and 12 ..mu..m grew with either an (111) or (233) orientation. The growth and morphology of the silicon deposit was studied as a function of temperature and the partial pressure of oxygen. Depositions at substrate temperatures of 950 and 1100 /sup 0/C exceeded the epitaxial temperatures producing films that had faceted grains measuring 2--8 ..mu..m in cross section along with larger grains measuring nearly 200 ..mu..m across. The introduction of 10/sup -10/ Torr partial pressure of oxygen during deposition at 1100 /sup 0/C changed the morphology and eliminated the large grains. The presence of oxygen at 800 /sup 0/C prevented epitaxial growth.

Research Organization:
Ames Laboratory, USDOE, Iowa State University, Ames, Iowa 50011
DOE Contract Number:
W-7405-ENG-82
OSTI ID:
6128490
Journal Information:
J. Appl. Phys.; (United States), Journal Name: J. Appl. Phys.; (United States) Vol. 52:8; ISSN JAPIA
Country of Publication:
United States
Language:
English