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Growth of polycrystalline silicon on molybdenum, tantalum, tungsten, and their disilicides

Journal Article · · J. Appl. Phys.; (United States)
DOI:https://doi.org/10.1063/1.331638· OSTI ID:5591196

Silicon was electron beam vaporized in an ultralow pressure system on substrates of molybdenum, tantalum, and tungsten between 550--850 /sup 0/C. Polycrystalline silicon was grown on the molybdenum and tungsten substrates at 550 /sup 0/C with grains measuring approx.0.3 ..mu..m in cross section and having a )110) orientation. This orientation was attributed to the deposition technique and substrate temperature. At 670 /sup 0/C silicon reacted with the tantalum substrates to form a thin interfacial layer of TaSi/sub 2/ but grew with a )110) and )111) orientation. At this same sample temperature )111) and )110) polycrystalline silicon was detected on molybdenum and tungsten. By increasing the substrate temperature to 750 /sup 0/C, silicon reacted with the metals to produce ''columnar'' structures composed of )110), )111), )100), )311), or )331) silicon crystallites that grew on a layer of the respective metal disilicide. Phosphorus coevaporated with the silicon retarded the rate of the silicide growth at 670 and 750 /sup 0/C. Only the refractory metal disilicides MoSi/sub 2/, TaSi/sub 2/, and WSi/sub 2/ were obtained at 850 /sup 0/C by reaction of the vapor deposited silicon with the substrate metal.

Research Organization:
Ames Laboratory, USDOE, Iowa State University, Ames, Iowa 50011
OSTI ID:
5591196
Journal Information:
J. Appl. Phys.; (United States), Journal Name: J. Appl. Phys.; (United States) Vol. 53:3; ISSN JAPIA
Country of Publication:
United States
Language:
English