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Kinetics of the solid-state amorphizing reaction in thin films studied by electrical resistivity

Journal Article · · Appl. Phys. Lett.; (United States)
DOI:https://doi.org/10.1063/1.101747· OSTI ID:6095662
We deposited Ni-Zr thin-film multilayers by electron beam evaporation onto polished alumina substrates. The multilayers were annealed at a constant heating rate, and /ital in/ /ital situ/ resistance measurements made to derive the growth kinetics of amorphous NiZr alloy at the Ni/Zr interfaces. Using a simple model that relates resistance change to amorphous-layer thickness, we derive the apparent diffusivity of nickel in amorphous Ni/sub 50/Zr/sub 50/, /ital D//sub Ni/ =2.5/times/10/sup /minus/5/ exp(/minus/1.01(/ital eV/)//ital kT/) cm/sup 2/ s/sup /minus/1/.
Research Organization:
Center for Materials Science and MST-7, Los Alamos National Laboratory, Mail Stop K 765, Los Alamos, New Mexico 87545(US)
OSTI ID:
6095662
Journal Information:
Appl. Phys. Lett.; (United States), Journal Name: Appl. Phys. Lett.; (United States) Vol. 55:1; ISSN APPLA
Country of Publication:
United States
Language:
English