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Si and N dangling bond creation in silicon nitride thin films

Journal Article · · Applied Physics Letters; (United States)
DOI:https://doi.org/10.1063/1.110420· OSTI ID:6082513
 [1];  [2];  [3]
  1. Sandia National Laboratories, Advanced Materials Laboratory, Albuquerque, New Mexico 87106 (United States)
  2. National Power Laboratories, Leatherhead, Surrey, KT22-7SE (United Kingdom)
  3. IBM Research Division, T. J. Watson Research Center, Yorktown Heights, New York 10598 (United States)
We observe the simultaneous creation of paramagnetic Si and N dangling bonds when N-rich silicon nitride thin films are optically illuminated at low temperatures (110 K). Generally, only the Si dangling bond is observed if the illumination is performed at room temperature. In contrast, the N dangling bond is metastable, and has previously only been observed after a high temperature post-deposition anneal and followed by illumination. We propose that the low temperature illumination causes two processes: (1) Charge conversion of N[sub 3][equivalent to]Si[sup +] and N[sub 3][equivalent to]Si[sup [minus]] sites to give two N[sub 3][equivalent to]Si[center dot]dangling bonds, and (2) charge transfer between Si[sub 2]=N[sup [minus]] and N[sub 3][equivalent to]Si[sup +] sites to form Si[sub 2]=N[center dot] and N[sub 3][equivalent to]Si[center dot]dangling bonds.
DOE Contract Number:
AC04-76DP00789
OSTI ID:
6082513
Journal Information:
Applied Physics Letters; (United States), Journal Name: Applied Physics Letters; (United States) Vol. 63:19; ISSN APPLAB; ISSN 0003-6951
Country of Publication:
United States
Language:
English