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Creation and properties of nitrogen dangling bond defects in silicon nitride thin films

Journal Article · · Journal of the Electrochemical Society
DOI:https://doi.org/10.1149/1.1837272· OSTI ID:428173
;  [1];  [2];  [3];  [4]
  1. Sandia National Labs., Albuquerque, NM (United States)
  2. Univ. of Cambridge (United Kingdom). Dept. of Engineering
  3. Univ. of Michigan, Ann Arbor, MI (United States). Center for Display Technology
  4. Army Research Lab., Fort Monmouth, NJ (United States)

The photocreation mechanisms and properties of nitrogen dangling bonds in amorphous hydrogenated silicon nitride (a-SiN{sub x}:H) thin films are investigated. The authors find that the photocreation is strongly dependent on film deposition conditions, illumination temperature, and postdeposition thermal treatment. Results suggest that H largely passivates N dangling bonds and/or precursor sites in the as-deposited films. The N-H bonds can then dissociate by a high-temperature deposition or postdeposition anneal (T > 500 C), leaving behind charged N sites which become paramagnetic after exposure to UV light. The N dangling bond is found to be an electrically active point defect. Its electrical and magnetic properties can be explained by assuming that the N defect centers can be cycled between its positive, negative, and neutral charge states.

Research Organization:
Sandia National Laboratory
Sponsoring Organization:
Sandia National Labs., Albuquerque, NM (United States)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
428173
Journal Information:
Journal of the Electrochemical Society, Journal Name: Journal of the Electrochemical Society Journal Issue: 11 Vol. 143; ISSN 0013-4651; ISSN JESOAN
Country of Publication:
United States
Language:
English

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