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Influence of electronic structure on XeF[sub 2] etching of silicon

Journal Article · · Journal of Vacuum Science and Technology, A (Vacuum, Surfaces and Films); (United States)
DOI:https://doi.org/10.1116/1.578409· OSTI ID:6045429
; ;  [1]
  1. Department of Physics, University of California, Riverside, California 92521 (United States)

The work function and Fermi level pinning position of Si(111) exposed to XeF[sub 2] are measured with soft x-ray photoemission spectroscopy. The exposures range from the chemisorption of F on Si(111)-7[times]7 to steady-state etching. The work function increases monotonically with XeF[sub 2] exposure. The Fermi level is pinned near midgap after each exposure, but moves upwards towards the conduction band as the exposure is increased. The results are discussed in terms of the electronic structure of the surface reaction layer, and a chemical etching mechanism is proposed.

DOE Contract Number:
AC02-76CH00016
OSTI ID:
6045429
Journal Information:
Journal of Vacuum Science and Technology, A (Vacuum, Surfaces and Films); (United States), Journal Name: Journal of Vacuum Science and Technology, A (Vacuum, Surfaces and Films); (United States) Vol. 11:4; ISSN 0734-2101; ISSN JVTAD6
Country of Publication:
United States
Language:
English