Alternative methods for bonding solar array interconnects

Conference · Wed Aug 01 00:00:00 EDT 1984 · Proc., Intersoc. Energy Convers. Eng. Conf.; (United States)

OSTI ID:6042763

Kelley, G J

Various types of solder and application techniques have been evaluated in order to improve the survivability of solar array interconnections during thermal cycling. The performance of each method has been compared by visual examination of the bonded joints, pull tests and resistance measurements before and after thermal cycling. The samples have been cycled up to 20,000 times from -75/sup 0/C to +65/sup 0/C to simulate the temperature environment typically encountered by solar arrays in low earth orbit. The results of these tests show that tinsilver solder will withstand thermal cycling with minimal degradation, when compared to the frequently used tin-lead-silver type.

• Research Organization: Solarex Aerospace, Gaithersburg, MD
• OSTI ID: 6042763
• Report Number(s): CONF-840804-
• Journal Information: Proc., Intersoc. Energy Convers. Eng. Conf.; (United States), Vol. 1; Conference: Intersociety energy conversion engineering conference, San Francisco, CA, USA, 19 Aug 1984
• Country of Publication: United States
• Language: English

Related Subjects

14 SOLAR ENERGY
SOLAR CELL ARRAYS
SOLDERING
SOLDERED JOINTS
PERFORMANCE
LEAD
OPTIMIZATION
PHOTOVOLTAIC POWER SUPPLIES
SERVICE LIFE
SILVER
SPACECRAFT POWER SUPPLIES
TEMPERATURE EFFECTS
THERMAL DEGRADATION
TIN
ELECTRONIC EQUIPMENT
ELEMENTS
EQUIPMENT
FABRICATION
JOINING
JOINTS
METALS
POWER SUPPLIES
SOLAR EQUIPMENT
TRANSITION ELEMENTS
WELDING
140501* - Solar Energy Conversion- Photovoltaic Conversion