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Dose rate dependence and time constant of the ion-beam-induced crystallization mechanism in silicon

Journal Article · · J. Appl. Phys.; (United States)
DOI:https://doi.org/10.1063/1.339027· OSTI ID:5977504

The influence of dose rate on the ion-beam-induced crystallization of amorphous layers in silicon has been investigated. The amorphous layers were produced by self-ion implantation both in bulk silicon and in silicon on sapphire. Subsequent recrystallization was induced at 200 to 400 /sup 0/C by Ne, Si, Ar, and Kr ion beams of 300 keV energy passing through the amorphous layers. Rutherford backscattering/channeling measurements showed that the regrowth rate decreased with increasing dose rate. This behavior was more pronounced for heavy ions where high dose rates and/or low temperatures could reverse the recrystallization and induce further amorphous growth of the layer. In this new solid-phase growth regime, the amorphous/crystalline interface moved inwards into the crystal in a manner similar to an epitaxial process. An intermittent beam experiment yielded a time constant for the ion beam induced crystallization mechanism of the order of 0.3 s. The time constant and a scaling law for different ions support a model where the planar growth is caused by the accumulation of divacancies in the interface region.

Research Organization:
Department of Physics, Chalmers University of Technology, S-412 96 Goeteborg, Sweden
OSTI ID:
5977504
Journal Information:
J. Appl. Phys.; (United States), Journal Name: J. Appl. Phys.; (United States) Vol. 62:12; ISSN JAPIA
Country of Publication:
United States
Language:
English