Analysis of the trade-offs between conventional and superconducting interconnections
Superconductivity can now be achieved at temperatures compatible with semiconductor device operation. This raises the interesting possibility of using the new, high-temperature superconducting ceramics for interconnections in electronic systems. This paper examines some of the consequences of a resistance-free interconnection medium. A problem with conventional conductors in electronic systems is that the resistance of wires increases quadratically as the wire dimensions are scaled down. Below some minimum cross-sectional area, determined by the metal resistivity and wire length, the resistance in these lines begins to severely limit their bandwidth. Superconductors, on the other hand, are not constrained by the same scaling rules. They provide a high bandwidth interconnection at all sizes and lengths. The limitations for superconductors are set by their critical current densities. If line dimensions become too small, a superconductor will no longer support an adequate flow of current. An analysis is presented examining the performance trade-offs for conventional and superconducting interconnections in applications ranging from printed wiring boards to chips. For most semiconductor device-based applications, the potential gains in wiring density offered by superconductors are probably more important than the bandwidth improvements. An important result of the analysis is that it determines the values of critical current density above which superconductors outperform conventional wires in systems of various physical sizes. This identifies particular interconnection technologies for which high-temperature superconductors show the most promise.
- Research Organization:
- 9524635
- OSTI ID:
- 5969838
- Journal Information:
- IEEE Circuits Devices; (United States), Journal Name: IEEE Circuits Devices; (United States) Vol. 5:3; ISSN ICDME
- Country of Publication:
- United States
- Language:
- English
Similar Records
YBa sub 2 Cu sub 3 O sub 7 minus x to Si interconnection for hybrid superconductor/ semiconductor integration
Microstructural defects and superconducting critical currents in superconductors
Related Subjects
360204 -- Ceramics
Cermets
& Refractories-- Physical Properties
420201* -- Engineering-- Cryogenic Equipment & Devices
656100 -- Condensed Matter Physics-- Superconductivity
71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
CERAMICS
CRITICAL CURRENT
CROSS SECTIONS
CURRENT DENSITY
CURRENTS
ELECTRIC CONDUCTIVITY
ELECTRIC CURRENTS
ELECTRICAL PROPERTIES
HIGH TEMPERATURE
MATERIALS TESTING
PHYSICAL PROPERTIES
SUPERCONDUCTING DEVICES
SUPERCONDUCTING WIRES
SUPERCONDUCTIVITY
TECHNOLOGY ASSESSMENT
TESTING
WIRES