Decomposition of formic acid on copper, nickel, and copper-nickel alloys. II. Catalytic and temperature-programmed decomposition of formic acid on Cu/SiO/sub 2/, Cu/Al/sub 2/O/sub 3/, and Cu powder

Journal Article · Sun May 01 00:00:00 EDT 1983 · J. Catal.; (United States)

OSTI ID:5960432

Iglesia, E; Boudart, M

Turnover rates for the catalytic dehydrogenation of formic acid (HCOOH) on copper/silica (Cu/SiO/sub 2/)(Cu/Al/sub 2/O/sub 3/) and Cu powder between 380 and 500K are reported. The turnover rate is independent of HCOOH partial pressure between 1.5 and 6 kPa, concentration of decomposition products, metal loading (0.33-19.2%), metal dispersion (0.03-22%), and the nature of the support. HCOOH adsorption on Cu at room temperature leads to the formation of surface formate. Its decomposition rate constant agrees with that reported for the catalytic decomposition of HCOOH on Cu, and the decomposition of HCOOH preadsorbed on Cu(110) at low coverage. 5 figures, 3 tables.

• Research Organization: Stanford Univ., CA
• OSTI ID: 5960432
• Journal Information: J. Catal.; (United States), Journal Name: J. Catal.; (United States) Vol. 81:1; ISSN JCTLA
• Country of Publication: United States
• Language: English

Related Subjects

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY
400201 -- Chemical & Physicochemical Properties
400301* -- Organic Chemistry-- Chemical & Physicochemical Properties-- (-1987)
ACTIVATION ENERGY
ADSORPTION
ALUMINIUM COMPOUNDS
ALUMINIUM OXIDES
BINARY MIXTURES
CARBOXYLIC ACIDS
CATALYST SUPPORTS
CATALYTIC EFFECTS
CHALCOGENIDES
CHEMICAL ANALYSIS
CHEMICAL REACTION KINETICS
CHEMICAL REACTIONS
COPPER
DATA
DECOMPOSITION
DISPERSIONS
ELEMENTS
ENERGY
EXPERIMENTAL DATA
FORMIC ACID
HIGH TEMPERATURE
INFORMATION
KINETICS
LOW PRESSURE
MEDIUM TEMPERATURE
METALS
MINERALS
MIXTURES
MONOCARBOXYLIC ACIDS
NICKEL
NUMERICAL DATA
ORGANIC ACIDS
ORGANIC COMPOUNDS
OXIDE MINERALS
OXIDES
OXYGEN COMPOUNDS
PHYSICAL PROPERTIES
PRESSURE DEPENDENCE
QUANTITATIVE CHEMICAL ANALYSIS
REACTION KINETICS
SILICA
SILICON COMPOUNDS
SILICON OXIDES
SORPTION
TEMPERATURE DEPENDENCE
THERMAL CONDUCTIVITY
THERMODYNAMIC PROPERTIES
TRANSITION ELEMENTS