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Decomposition of formic acid on copper, nickel, and copper-nickel alloys. III. Catalytic decomposition on nickel and copper-nickel alloys

Journal Article · · J. Catal.; (United States)

Turnover rates for the catalytic dehydrogenation and dehydration of formic acid (HCOOH) on nickel/silica (Ni/SiO/sub 2/) and Ni and copper-nickel (CuNi) powders between 390 and 490 K are reported. The decomposition rate constants calculated from these data are compared with values reported previously for the temperature-programmed decomposition (TPD) of HCOOH preadsorbed on Ni and CuNi. Catalytic dehydrogenation and dehydration seem to proceed through the same intermediate, believed to be a formate ion. The selectivity S, defined as the ratio of dehydrogenation to dehydration turnover rates, is independent of temperature, and between 4 and 6 on Ni and alloys with a surface Cu fraction less than 0.8. The observed selectivity is not affected by secondary reactions among the products. The intermediate appears to be bound to two adjacent Ni atoms. In contrast, TPD or HCOOH preadsorbed at low coverage on CuNi single crystals seems to involve a formic anhydride species that requires four adjacent Ni atoms, and decomposes with S equal to unity and a rate constant 5 x 10/sup 3/ times greater than that corresponding to the catalytic decomposition. This study demonstrated the differences in rate constant and S when reactive intermediates change with surface coverage because they require different ensembles for adsorption; in other words, they are structure sensitive.

Research Organization:
Stanford Univ., CA
OSTI ID:
5960427
Journal Information:
J. Catal.; (United States), Journal Name: J. Catal.; (United States) Vol. 81:1; ISSN JCTLA
Country of Publication:
United States
Language:
English

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