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Kinetics of Pd/sub 2/Si layer growth measured by an x-ray diffraction technique

Journal Article · · J. Appl. Phys.; (United States)
DOI:https://doi.org/10.1063/1.336816· OSTI ID:5957007
An x-ray diffraction approach has been developed for determination of the kinetics of growth of Pd/sub 2/Si layers. Epitaxial Pd/sub 2/Si films were grown on Si(111) substrates over a temperature range of 160-222/sup 0/C by a solid-state reaction between the substrates and the Pd overlayers. The parabolic rate equation was verified and rate constants showed Arrhenius behavior with an activation energy E/sub a/ = 1.06 eV and prefactor k/sub 0/ = 7 x 10/sup -4/ cm/sup 2//s. The low value of E/sub a/ suggests a short-circuit diffusion mechanism. It is reasonable to expect that impurities and microstructure may play important roles in the growth process. Impurity levels in the specimens were evaluated by analytic techniques suited to thin-film study: Rutherford backscattering spectrometry, secondary ion mass spectrometry, and Auger electron spectrometry. No impurities were present at concentrations approaching 1 at. %. Some O, C, and F were detected at the Pd/sub 2/Si/Si interfaces. The annealing ambient was the major source of further contamination. Upon emergence of the growth interface through the sample surface (some Pd/sub 2/Si on surface), impurity pickup was detected. Interfacial roughness was indicated by all the techniques to be on the order of 20 nm.
Research Organization:
Department of Metallurgy and Mining Engineering and the Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801
DOE Contract Number:
AC02-76ER01198
OSTI ID:
5957007
Journal Information:
J. Appl. Phys.; (United States), Journal Name: J. Appl. Phys.; (United States) Vol. 59:10; ISSN JAPIA
Country of Publication:
United States
Language:
English