Pulsed electrodeposition. Final report
Pulse plating of cobalt-hardened gold alloys increases the cobalt content in the alloy. At lower duty cycles, the electrodeposits become dull. Little change in the microhardness was observed between pulsed and direct current electrodeposits. The TEM and electron diffraction analyses indicated no significant difference in microstructure between pulsed and conventional gold alloy electrodeposits. Pulse plated and conventional nickel deposits have been compared for differences in morphology, mechanical properties, and microstructure. The deposits were obtained from nickel sulfamate, nickel chloride, and Watts nickel plating solutions. No significant differences were found in the direct and pulse current deposits from the sulfamate and chloride solutions; however, significant differences in microstructure, yield strength, and microhardness were observed in deposits from the Watts nickel solution.
- Research Organization:
- Bendix Corp., Kansas City, MO (USA)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 5943907
- Report Number(s):
- BDX-613-3179; ON: DE85007057
- Country of Publication:
- United States
- Language:
- English
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