Pulsed electrodeposition. Final report
Pulse plating of cobalt-hardened gold alloys increases the cobalt content in the alloy. At lower duty cycles, the electrodeposits become dull. Little change in the microhardness was observed between pulsed and direct current electrodeposits. The TEM and electron diffraction analyses indicated no significant difference in microstructure between pulsed and conventional gold alloy electrodeposits. Pulse plated and conventional nickel deposits have been compared for differences in morphology, mechanical properties, and microstructure. The deposits were obtained from nickel sulfamate, nickel chloride, and Watts nickel plating solutions. No significant differences were found in the direct and pulse current deposits from the sulfamate and chloride solutions; however, significant differences in microstructure, yield strength, and microhardness were observed in deposits from the Watts nickel solution.
- Research Organization:
- Bendix Corp., Kansas City, MO (USA)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 5943907
- Report Number(s):
- BDX-613-3179; ON: DE85007057
- Country of Publication:
- United States
- Language:
- English
Similar Records
Microstructure, texture and tensile behavior of pulsed electrodeposited Ni–Al composites produced using organic additive-free sulfamate bath loaded with Al nanoparticles
ELECTRODEPOSITION OF COBALT BASE ALLOYS. Interim Technical Report Covering the Period October 1, 1956 tp April 1, 1957