Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Development of metallization process: FSA project, cell and module formation research area. Quarterly technical progress report No. 6329-12 for the period ending March 31, 1983

Technical Report ·
DOI:https://doi.org/10.2172/5893611· OSTI ID:5893611
The use of CO in place of H/sub 2/ for the reducing step did not appreciably increase solderability of interconnects. Cells were also made printing the pastes on top of ITO coatings. Some of these cells were the best electrically but the metallization was still not adhering. Sequential use of H/sub 2/ and CO had no effect on adhesion (or lack of it).
Research Organization:
Spectrolab, Inc., Sylmar, CA (USA)
DOE Contract Number:
NAS-7-100-956205
OSTI ID:
5893611
Report Number(s):
DOE/JPL/956205-83/4; ON: DE83015172
Country of Publication:
United States
Language:
English