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Silicon MBE apparatus for uniform high-rate deposition on standard format wafers

Journal Article · · J. Vac. Sci. Technol.; (United States)
DOI:https://doi.org/10.1116/1.571347· OSTI ID:5848761
The design and operation of a second generation silicon MBE apparatus are described. A large sample loading interlock permits rapid introduction of standard format 3--4-in.-diam silicon and sapphire substrates. Silicon and metallic species are deposited from dual e-beam evaporation sources at rates of up to 1/3 ..mu..m/min. Dopants are introduced by evaporation from conventional Knudsen cells or by simultaneous, low energy ion implantation. Silicon, metal and ionized dopant fluxes are directly sensed and regulated to within approx.1% of preprogrammed values. Rotation of the substrate yields deposition uniformity of < or =1% across a 3-in. wafer. The system includes instrumentation for low and high energy electron diffraction, Auger electron spectroscopy and residual gas analysis.
Research Organization:
Bell Laboratories, Murray Hill, New Jersey 07974
OSTI ID:
5848761
Journal Information:
J. Vac. Sci. Technol.; (United States), Journal Name: J. Vac. Sci. Technol.; (United States) Vol. 20:2; ISSN JVSTA
Country of Publication:
United States
Language:
English