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U.S. Department of Energy
Office of Scientific and Technical Information

Transfer of TiN/Ti/Ag metallization research

Technical Report ·
OSTI ID:5838645
A simple technology for manufacturing extremely stable silicon solar cells is described. The process uses a sputtering technique to reactively deposit high quality TiN films to be used as diffusion barrier layers in metallization systems. The deposition parameters have been optimized to yield films with low-stress and with resistivities as low as 50..mu.. ohm-cm. The TiN films act as an excellent metal diffusion barrier layer below the contact grid-lines, and also upon controlled oxidation as a good anti-reflection coating of TiO/sub 2/ in the active area of the solar cell. Such a unique and dual application of the TiN layer considerably simplifies the fabrication of the cells. Cells so prepared are found to be stable with no degradation in their electrical performance after heat treatments up to 600/sup 0/C for 15 minutes. The application of TiN films in obtaining stable ohmic contacts to GaAs has also been investigated. Ohmic contacts to p-type GaAs have been formed with GaAs/Pt(mG)/TiN/Ag system, which possess low contact resistivity stable up to 550/sup 0/C heat treatments.
Research Organization:
Applied Solar Energy Corp., City of Industry, CA (USA)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
5838645
Report Number(s):
SAND-86-7037; ON: DE86012248
Country of Publication:
United States
Language:
English