Trilayer photoresist definition with high pressure plasmas
Pattern transfer from a mask plate to a photoresist film by multilayer resist techniques consists of image transfer to a thin photosensitive layer which is separated from a thick underlying organic planarizing layer by an inorganic barrier film. After exposure and development of the imaging photoresist pattern transfer is completed by successively etching the intermediate and planarizing coatings such that the vertical profiles which are defined in the imaging layer are transferred into the lower layers. Reported herein is a two-step etching process which is carried out at high pressure (>1000 mtorr) and low radio frequency (RF) (0.4 mHz) for both steps in a Perkin-Elmer Omni-Etch 10000 single-wafer system.
- Research Organization:
- Westinghouse Electric Corp., Advanced Technology Lab., Baltimore, MD 21203
- OSTI ID:
- 5762003
- Journal Information:
- J. Electrochem. Soc.; (United States), Journal Name: J. Electrochem. Soc.; (United States) Vol. 134:8A; ISSN JESOA
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
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420800 -- Engineering-- Electronic Circuits & Devices-- (-1989)
ALUMINIUM
COMPOSITE MATERIALS
ELECTRIC FIELDS
ELECTRICAL EQUIPMENT
ELECTROMAGNETIC RADIATION
ELECTRON MICROSCOPY
ELECTRONIC CIRCUITS
ELEMENTS
ENERGY DENSITY
EQUIPMENT
ETCHING
FABRICATION
HIGH PRESSURE
IMAGES
INTEGRATED CIRCUITS
ISOTROPY
LAYERS
LOW TEMPERATURE
MATERIALS
MEMORY DEVICES
METALLOGRAPHY
METALS
MICROELECTRONIC CIRCUITS
MICROSCOPY
MOS TRANSISTORS
PHOTORESISTORS
PLASMA
RADIATIONS
RADIOWAVE RADIATION
RESISTORS
SCANNING ELECTRON MICROSCOPY
SEMICONDUCTOR DEVICES
SEMIMETALS
SILICON
SUBSTRATES
SURFACE FINISHING
TRANSISTORS