Chemical nickel plating in the presence of T1(I)

Journal Article · Sat Mar 01 04:00:00 EST 1986 · Prot. Met. (Engl. Transl.); (United States)

OSTI ID:5701984

Zhelis, K P; Val'syuenne, Y I; Zhelene, A Y

When added to a borohydride nickel-plating solution, T1(I) increases the coating deposition rate from 6 to 30 or 100 um/h. The authors make a more detailed determination of how the process conditions and the proportions of the solution components influence the rate of deposition and composition of the coatings. They also examine the prospects for further increase in the rate and the possibility of correcting the solution in order to maximize its service life. It was found that thailium, included in the nickel-boron coating, facilitates the catalytic oxidation of borohydride--the promoter of this process.

• Research Organization: Institute of Chemistry, Academy of Sciences of the Lithuanian SSR
• OSTI ID: 5701984
• Journal Information: Prot. Met. (Engl. Transl.); (United States), Journal Name: Prot. Met. (Engl. Transl.); (United States) Vol. 21:4; ISSN PTNMA
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360101* -- Metals & Alloys-- Preparation & Fabrication
BORON
BORON COMPOUNDS
BORON HYDRIDES
CHEMICAL COMPOSITION
CHEMICAL REACTION KINETICS
COATINGS
CORROSION PROTECTION
DEPOSITION
ELECTRODEPOSITED COATINGS
ELECTRODEPOSITION
ELECTROLYSIS
ELECTROPLATING
ELEMENTS
HYDRIDES
HYDROGEN COMPOUNDS
ION EXCHANGE
KINETICS
LYSIS
METALLURGICAL EFFECTS
METALS
NICKEL
PLATING
PROTECTIVE COATINGS
QUANTITY RATIO
REACTION KINETICS
SEMIMETALS
SERVICE LIFE
SURFACE COATING
THALLIUM
THALLIUM COMPOUNDS
TRANSITION ELEMENTS