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Comparison of isopropyl alcohol and trichloroethylene in removing solder flux: Topical report

Technical Report ·
OSTI ID:5679316

This work evaluated a nontoxic solvent for its ability to remove solder flux as compared to trichloroethylene solvent. Isopropyl alcohol was evaluated for its cleaning efficiency for solder flux removal using a high pressure spray process (minimum spray pressure of 80 psig). Cleanliness levels were measured by the Meseran Surface Analyzer. Test samples also underwent gas chromatograph/mass spectrometer Analysis and were visually inspected under a longwave ultraviolet lamp. Detailed analyses of flux removal by the two solvents were made as related to solder flux types, solder flux diluted by 50% with isopropyl alcohol, and solder process conditions. 2 refs., 2 figs., 12 tabs.

Research Organization:
Allied-Signal, Inc., Kansas City, MO (USA). Bendix Kansas City Div.
DOE Contract Number:
AC04-76DP00613
OSTI ID:
5679316
Report Number(s):
BDX-613-3878; ON: DE88005556
Country of Publication:
United States
Language:
English