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Cleanliness tests with the Omega Meter: A comparative study for solder flux removal

Technical Report ·
OSTI ID:5486336

This paper reports on a dynamic conductivity test which indicates the effectiveness of solder flux removal. The Omega Meter, a device to measure residual ionic contaminants has been used to measure cleanliness as required by MIL-P-15110 and MIL-P-28809. The cleaning efficiency of seven solvents in removing three basic types of rosin solder fluxes after solder dipping has been evaluated. Results obtained indicate fairly good correlation with those obtained from radiochemical techniques and evaporative rate analysis using the Meseran Surface Analyzer. In this study, using vapor degreasing as the method of cleaning, isopropyl alcohol, trichloroethylene, and 1,1,1 trichloroethane (stabilized) respectively were the best single solvents identified in the removal of types R, RMA, and RA rosin solder fluxes. 3 refs., 6 figs., 3 tabs.

Research Organization:
Sandia National Labs., Albuquerque, NM (USA)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
5486336
Report Number(s):
SAND-87-1882; ON: DE88004634
Country of Publication:
United States
Language:
English