Superplastic creep of low melting point solder joints

Journal Article · Wed Apr 01 04:00:00 EST 1992 · Journal of Electronic Materials (A.I.M.E. Metallurgical Society); (United States)

DOI:https://doi.org/10.1007/BF02660403· OSTI ID:5656892

Mei, Z; Morris, Jr, J W ^[1]

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1. Lawrence Berkeley Lab., CA (United States) Univ. of California, Berkeley, CA (United States)

In prior work, we showed that eutectic Sn-Pb solder joints exhibit superplastic behavior after rapid solidification. Further examples of superplasticity in nominally air-cooled solder joints are reported in this study of three low-melting point alloys: 40In-40Sn-20Pb (wt.%), eutectic 52In-48Sn, and 43Sn-43Pb-14Bi, which were creep-tested in shear at 20[degrees], 65[degrees], and 90[degrees]C. The test results indicate that above 65[degree]C, the indium-containing solders have stress exponents between 2.4 to 2.9, a possible overall shear strains of 500%, and an absence of primary creep; at 90[degrees]C, 43Sn-43Pb-14Bi solder has a stress exponent close to 2.3. Optical microstructures of the three solders are presented; they help to explain the superplastic behavior. 16 refs., 7 figs., 1 tab.

• OSTI ID: 5656892
• Journal Information: Journal of Electronic Materials (A.I.M.E. Metallurgical Society); (United States), Journal Name: Journal of Electronic Materials (A.I.M.E. Metallurgical Society); (United States) Vol. 21:4; ISSN JECMA5; ISSN 0361-5235
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360101* -- Metals & Alloys-- Preparation & Fabrication
360103 -- Metals & Alloys-- Mechanical Properties
ALLOYS
BISMUTH ALLOYS
CREEP
EUTECTICS
FABRICATION
FATIGUE
INDIUM ALLOYS
JOINING
JOINTS
LEAD ALLOYS
MECHANICAL PROPERTIES
MELTING POINTS
MICROSTRUCTURE
PHASE TRANSFORMATIONS
PHYSICAL PROPERTIES
PLASTICITY
SOLDERED JOINTS
SOLDERING
SOLIDIFICATION
THERMODYNAMIC PROPERTIES
TIN ALLOYS
TRANSITION TEMPERATURE
WELDING