Constitutive behavior of 40Sn-40In-20Pb and 50In-50Pb solders
Technical Report
·
OSTI ID:548765
- Sandia National Labs., Albuquerque, NM (United States). Materials Aging and Reliability, Bulk Properties Dept.
This work was performed to characterize the time dependent deformation behavior of two solder alloys typically used in radar applications, 40Sn-40In-20Pb and 50In-50Pb by weight percent. The near-eutectic 60Sn-40Pb alloy was sued as a baseline comparison. The time-dependent deformation was measured using isothermal uniaxial compression creep tests. The data was reduced and, using a least squares fit algorithm, formatted into the Sherby-Dorn power law creep equation. The derived constitutive relationships were then used as a primary input to a solid mechanics, finite element model to predict solder joint lifetime and reliability. For a fixed applied stress, 40Sn-40In-20Pb had slower creep rates, at all temperatures, compared to 50In-50Pb and the baseline near eutectic 60Sn-40Pb solder. At temperatures above 70 C, the 50In-50Pb had faster creep rates than 60 Sn-40Pb. At lower temperatures, the 60Sn-40Pb solder had a higher creep rate due, in part, to its heterogeneous structure and large number of grain boundaries available for grain boundary sliding and rotation compared to 50In-50Pb.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 548765
- Report Number(s):
- SAND--97-1625; ON: DE98001275; BR: DP0102021
- Country of Publication:
- United States
- Language:
- English
Similar Records
Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys
Thermomechanical fatigue of solder joints: A new comprehensive test method
Characterization of eutectic Sn-Bi solder joints
Journal Article
·
Fri Jul 01 00:00:00 EDT 1994
· Metallurgical Transactions, A (Physical Metallurgy and Materials Science); (United States)
·
OSTI ID:7277880
Thermomechanical fatigue of solder joints: A new comprehensive test method
Conference
·
Sat Dec 31 23:00:00 EST 1988
·
OSTI ID:6294785
Characterization of eutectic Sn-Bi solder joints
Journal Article
·
Mon Jun 01 00:00:00 EDT 1992
· Journal of Electronic Materials (A.I.M.E. Metallurgical Society); (United States)
·
OSTI ID:5432634