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Polysilicon-contacted P/sup +/ emitters for silicon solar cell applications

Technical Report ·
OSTI ID:5626063
A polysilicon-contact technology was investigated as a method of reducing the minority carrier recombination that occurs in boron-doped p/sup +/ emitter structures in silicon. Two different polysilicon processes using low-pressure chemical-vapor deposition were used. Undoped polysilicon that was later doped by furnace predeposition was compared with in situ-doped polysilicon followed by diffusion. PNP transistors were used as the test structure. The emitter saturation current densities measured on devices with and without polysilicon were compared. The effect of a chemically grown oxide beneath the polysilicon was also investigated. Devices with polysilicon-contacted emitters performed marginally better than those with simple metal contacts. A barrier oxide between the polysilicon and single-crystal emitter was found to offer additional improvement. The magnitude of the emitter saturation current densities observed was not as low as that seen in n-type emitter structures. 10 refs., 13 figs., 12 tabs.
Research Organization:
SERA Solar Corp., Santa Clara, CA (USA)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
5626063
Report Number(s):
SAND-87-7021; ON: DE88005106
Country of Publication:
United States
Language:
English