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Title: Heat sinking for printed circuitry

Abstract

A flat pak or other solid-state device mounted on a printed circuit board directly over a hole extends therethrough so that the bottom of the pak or device extends beyond the bottom of the circuit board. A heat sink disposed beneath the circuit board contacts the bottom of the pak or device and provides direct heat sinking thereto. Pressure may be applied to the top of the pak or device to assure good mechanical and thermal contact with the heat sink.

Inventors:
; ;
Publication Date:
OSTI Identifier:
5621376
Application Number:
ON: DE85011585
Assignee:
Dept. of Energy EDB-85-087396
DOE Contract Number:
W-7405-ENG-36
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; PRINTED CIRCUITS; HEAT SINKS; ELECTRONIC CIRCUITS; SINKS; 420800* - Engineering- Electronic Circuits & Devices- (-1989)

Citation Formats

Wilson, S.K., Richardson, G., and Pinkerton, A.L. Heat sinking for printed circuitry. United States: N. p., 1984. Web.
Wilson, S.K., Richardson, G., & Pinkerton, A.L. Heat sinking for printed circuitry. United States.
Wilson, S.K., Richardson, G., and Pinkerton, A.L. 1984. "Heat sinking for printed circuitry". United States. doi:.
@article{osti_5621376,
title = {Heat sinking for printed circuitry},
author = {Wilson, S.K. and Richardson, G. and Pinkerton, A.L.},
abstractNote = {A flat pak or other solid-state device mounted on a printed circuit board directly over a hole extends therethrough so that the bottom of the pak or device extends beyond the bottom of the circuit board. A heat sink disposed beneath the circuit board contacts the bottom of the pak or device and provides direct heat sinking thereto. Pressure may be applied to the top of the pak or device to assure good mechanical and thermal contact with the heat sink.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = 1984,
month = 9
}
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