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Heat sinking for printed circuitry

Patent ·
OSTI ID:5621376
; ;

A flat pak or other solid-state device mounted on a printed circuit board directly over a hole extends therethrough so that the bottom of the pak or device extends beyond the bottom of the circuit board. A heat sink disposed beneath the circuit board contacts the bottom of the pak or device and provides direct heat sinking thereto. Pressure may be applied to the top of the pak or device to assure good mechanical and thermal contact with the heat sink.

DOE Contract Number:
W-7405-ENG-36
Assignee:
Dept. of Energy
Patent Number(s):
None
Application Number:
ON: DE85011585
OSTI ID:
5621376
Country of Publication:
United States
Language:
English

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Related Subjects

42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
ELECTRONIC CIRCUITS
HEAT SINKS
PRINTED CIRCUITS
SINKS