Multi-lead heat sink
- Albuquerque, NM
The disclosure relates to a heat sink used to protect integrated circuits from the heat resulting from soldering them to circuit boards. A tubular housing contains a slidable member which engages somewhat inwardly extending connecting rods, each of which is rotatably attached at one end to the bottom of the housing. The other end of each rod is fastened to an expandable coil spring loop. As the member is pushed downward in the housing, its bottom edge engages and forces outward the connecting rods, thereby expanding the spring so that it will fit over an integrated circuit. After the device is in place, the member is slid upward and the spring contracts about the leads of the integrated circuit. Soldering is now conducted and the spring absorbs excess heat therefrom to protect the integrated circuit. The placement steps are repeated in reverse order to remove the heat sink for use again.
- Research Organization:
- Los Alamos National Laboratory (LANL), Los Alamos, NM
- DOE Contract Number:
- W-7405-ENG-36
- Assignee:
- Regents of University of California (Berkeley, CA)
- Patent Number(s):
- US 4457360
- OSTI ID:
- 865068
- Country of Publication:
- United States
- Language:
- English
Similar Records
Multi-lead heat sink
Undercutting device for anchor holes
Related Subjects
absorbs
attached
boards
bottom
circuit
circuit board
circuit boards
circuits
coil
coil spring
conducted
connecting
connecting rod
connecting rods
contains
contracts
device
disclosure
disclosure relates
downward
edge
engages
excess
excess heat
expandable
expanding
extending
fastened
fit
forces
heat
heat resulting
heat sink
housing
housing contains
integrated
integrated circuit
integrated circuits
inwardly
inwardly extending
leads
loop
multi-lead
outward
placement
protect
pushed
relates
remove
repeated
resulting
reverse
rod
rods
rotatably
rotatably attached
sink
slid
slidable
soldering
somewhat
spring
steps
therefrom
tubular
tubular housing
upward