Thermal fatigue evaluation of solder alloys. Final report

Technical Report · Fri Feb 01 00:00:00 EST 1980

DOI:https://doi.org/10.2172/5563721· OSTI ID:5563721

Jarboe, D. M.

An evaluation was made of the relative thermal fatigue resistance of 29 solder alloys. A number of these alloys were found to be less susceptible to thermal fatigue cracking in encapsulated printed wiring board applications than the commonly used tin-lead eutectic (63Sn-37Pb). Three alloys, 95Sn-5Ag, 96.5Sn-3.5Ag, and 95Sn-5Sb offered the greatest resistance to thermal fatigue. The selection of the encapsulation materials was confirmed to be a significant factor in thermal fatigue of solder joints, regardless of the solder alloy used.

• Research Organization: Bendix Corp., Kansas City, MO (United States)
• DOE Contract Number: EY-76-C-04-0613
• OSTI ID: 5563721
• Report Number(s): BDX-613-2341; TRN: 80-005683
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
SOLDERED JOINTS
THERMAL FATIGUE
SILVER ALLOYS
TIN BASE ALLOYS
ANTIMONY ALLOYS
ALLOYS
CRACKS
SOLDERING
FABRICATION
FATIGUE
JOINING
JOINTS
MECHANICAL PROPERTIES
PNICTIDES
TIN ALLOYS
WELDING
360101* - Metals & Alloys- Preparation & Fabrication
360103 - Metals & Alloys- Mechanical Properties