Thermal fatigue evaluation of solder alloys. Final report
An evaluation was made of the relative thermal fatigue resistance of 29 solder alloys. A number of these alloys were found to be less susceptible to thermal fatigue cracking in encapsulated printed wiring board applications than the commonly used tin-lead eutectic (63Sn-37Pb). Three alloys, 95Sn-5Ag, 96.5Sn-3.5Ag, and 95Sn-5Sb offered the greatest resistance to thermal fatigue. The selection of the encapsulation materials was confirmed to be a significant factor in thermal fatigue of solder joints, regardless of the solder alloy used.
- Research Organization:
- Bendix Corp., Kansas City, MO (United States)
- DOE Contract Number:
- EY-76-C-04-0613
- OSTI ID:
- 5563721
- Report Number(s):
- BDX-613-2341; TRN: 80-005683
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
36 MATERIALS SCIENCE
SOLDERED JOINTS
THERMAL FATIGUE
SILVER ALLOYS
TIN BASE ALLOYS
ANTIMONY ALLOYS
ALLOYS
CRACKS
SOLDERING
FABRICATION
FATIGUE
JOINING
JOINTS
MECHANICAL PROPERTIES
PNICTIDES
TIN ALLOYS
WELDING
360101* - Metals & Alloys- Preparation & Fabrication
360103 - Metals & Alloys- Mechanical Properties
SOLDERED JOINTS
THERMAL FATIGUE
SILVER ALLOYS
TIN BASE ALLOYS
ANTIMONY ALLOYS
ALLOYS
CRACKS
SOLDERING
FABRICATION
FATIGUE
JOINING
JOINTS
MECHANICAL PROPERTIES
PNICTIDES
TIN ALLOYS
WELDING
360101* - Metals & Alloys- Preparation & Fabrication
360103 - Metals & Alloys- Mechanical Properties