skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Doping of In sub 0. 53 Ga sub 0. 47 As and In sub 0. 52 Al sub 0. 48 As by Si sup + and Be sup + ion implantation

Journal Article · · Journal of Applied Physics; (United States)
DOI:https://doi.org/10.1063/1.350745· OSTI ID:5551471
; ; ; ;  [1]
  1. AT T Bell Laboratories, Murray Hill, New Jersey 07974 (United States)

The activation kinetics and diffusion characteristics of Si{sup +} and Be{sup +} ions implanted into InAlAs and InGaAs were investigated for rapid thermal annealing in the temperature range 600--900 {degree}C. The apparent activation energies for electrical activation of Be are 0.43{plus minus}0.03 eV in InAlAs and 0.38{plus minus}0.03 eV in InGaAs, and for Si are 0.58{plus minus}0.05 eV in InAlAs and 0.64{plus minus}0.06 eV in InGaAs. Higher activation efficiencies are obtained for both dopants in InGaAs relative to InAlAs and anomalously low activation for low dose Be implants is observed due to a lack of vacant sites for the Be to occupy. Extensive redistribution of Be after annealing at 750 {degree}C, 10 s is observed in both materials, whereas Si shows no motion even for annealing at 850 {degree}C.

OSTI ID:
5551471
Journal Information:
Journal of Applied Physics; (United States), Vol. 71:1; ISSN 0021-8979
Country of Publication:
United States
Language:
English