Multi-layer enhancement to polysilicon surface-micromachining technology
Conference
·
OSTI ID:554818
- Sandia National Labs., Albuquerque, NM (United States). Intelligent Micromachine Dept.
A multi-level polysilicon surface-micromachining technology consisting of 5 layers of polysilicon is presented. Surface topography and film mechanical stress are the major impediments encountered in the development of a multilayer surface-micromachining process. However, excellent mechanical film characteristics have been obtained through the use of chemical-mechanical polishing for planarization of topography and by proper sequencing of film deposition with thermal anneals. Examples of operating microactuators, geared power-transfer mechanisms, and optical elements demonstrate the mechanical advantages of construction with 5 polysilicon layers.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 554818
- Report Number(s):
- SAND--97-2349C; CONF-971207--; ON: DE98000241; BR: DP0102022
- Country of Publication:
- United States
- Language:
- English
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