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U.S. Department of Energy
Office of Scientific and Technical Information

Process for encapsulating radioactive organic liquids in a resin

Patent ·
OSTI ID:5514636
A cured resin system is used to encapsulate certain liquid low-level radioactive wastes which are solvents for or are soluble in the uncured resin and which are more soluble in water than in the uncured resin. The process comprises the dilution of said waste with water to an extent that the amount of waste that will partition in the uncured resin system is less than the amount that will retard the cure rate of the system or that will adversely affect physical properties of the cured product, followed by the uniform dispersion of the aqueous solution in said curable resin system after which the resin system is cured to a solid with the aqueous waste solution dispersed therein.
Assignee:
The Dow Chemical Co.
Patent Number(s):
US 4405512
OSTI ID:
5514636
Country of Publication:
United States
Language:
English