Electrical and structural changes in the near surface of reactively ion etched InP
Journal Article
·
· Applied Physics Letters; (USA)
- AT T Bell Laboratories, Murray Hill, New Jersey 07974 (US)
Near-surface ({similar to}1000 A) modification in the net carrier concentration in {ital n}-type InP ({ital n}=6{times}10{sup 15}--1.5{times}10{sup 17} cm{sup {minus}3}) was observed after reactive ion etching (RIE) in Cl-based (CCl{sub 2}F{sub 2}/O{sub 2}) or organic-based (C{sub 2}H{sub 6}/H{sub 2}) discharges. The carrier loss is slightly more pronounced in the latter case, due possibly to the creation of deep level, compensating acceptors at greater depths as a result of implantation of the light hydrogen ions. Near-complete recovery of the initial carrier density occurs after annealing at 500 {degree}C for 30 s. Structural disorder is detected by ion channeling to depths of {similar to}400 A after C{sub 2}H{sub 6}/H{sub 2} RIE with a self-bias of 380 V. This disorder shows significant recovery after 400 {degree}C, 30 s annealing. Current-voltage measurements on Au Schottky diodes showed ohmic behavior after etching of the InP in a C{sub 2}H{sub 6}/H{sub 2} discharge, due to the nonstoichiometric surface remaining after RIE. Diodes fabricated on CCl{sub 2}F{sub 2}/O{sub 2} etched material show only a slight increase in reverse current compared to unetched control samples.
- OSTI ID:
- 5489990
- Journal Information:
- Applied Physics Letters; (USA), Journal Name: Applied Physics Letters; (USA) Vol. 55:16; ISSN APPLA; ISSN 0003-6951
- Country of Publication:
- United States
- Language:
- English
Similar Records
Suppression of side-etching in C{sub 2}H{sub 6}/H{sub 2}/O{sub 2} reactive ion etching for the fabrication of an InGaAsP/InP P-substrate buried-heterostructure laser diode
Damage induced by CHF/sub 3/+C/sub 2/F/sub 6/ plasma etching on Si-implanted GaAs(100)
Surface- and sidewall-damage of InP-based optoelectronic devices during reactive ion etching using CH{sub 4}/H{sub 2}
Journal Article
·
Tue Nov 30 23:00:00 EST 1993
· Journal of the Electrochemical Society
·
OSTI ID:142192
Damage induced by CHF/sub 3/+C/sub 2/F/sub 6/ plasma etching on Si-implanted GaAs(100)
Journal Article
·
Tue Sep 01 00:00:00 EDT 1987
· J. Appl. Phys.; (United States)
·
OSTI ID:6160593
Surface- and sidewall-damage of InP-based optoelectronic devices during reactive ion etching using CH{sub 4}/H{sub 2}
Book
·
Mon Dec 30 23:00:00 EST 1996
·
OSTI ID:536184
Related Subjects
36 MATERIALS SCIENCE
360605* -- Materials-- Radiation Effects
ANNEALING
BEAMS
CARRIER DENSITY
CHARGE CARRIERS
COLLISIONS
ELECTRIC DISCHARGES
ELECTRONIC STRUCTURE
ETCHING
FABRICATION
HEAT TREATMENTS
HIGH TEMPERATURE
IMPURITIES
INDIUM COMPOUNDS
INDIUM PHOSPHIDES
ION BEAMS
ION COLLISIONS
PHOSPHIDES
PHOSPHORUS COMPOUNDS
PHYSICAL RADIATION EFFECTS
PNICTIDES
RADIATION EFFECTS
SCHOTTKY BARRIER DIODES
SEMICONDUCTOR DEVICES
SEMICONDUCTOR DIODES
SURFACE FINISHING
360605* -- Materials-- Radiation Effects
ANNEALING
BEAMS
CARRIER DENSITY
CHARGE CARRIERS
COLLISIONS
ELECTRIC DISCHARGES
ELECTRONIC STRUCTURE
ETCHING
FABRICATION
HEAT TREATMENTS
HIGH TEMPERATURE
IMPURITIES
INDIUM COMPOUNDS
INDIUM PHOSPHIDES
ION BEAMS
ION COLLISIONS
PHOSPHIDES
PHOSPHORUS COMPOUNDS
PHYSICAL RADIATION EFFECTS
PNICTIDES
RADIATION EFFECTS
SCHOTTKY BARRIER DIODES
SEMICONDUCTOR DEVICES
SEMICONDUCTOR DIODES
SURFACE FINISHING