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Electrical and structural changes in the near surface of reactively ion etched InP

Journal Article · · Applied Physics Letters; (USA)
DOI:https://doi.org/10.1063/1.102221· OSTI ID:5489990
; ;  [1]
  1. AT T Bell Laboratories, Murray Hill, New Jersey 07974 (US)
Near-surface ({similar to}1000 A) modification in the net carrier concentration in {ital n}-type InP ({ital n}=6{times}10{sup 15}--1.5{times}10{sup 17} cm{sup {minus}3}) was observed after reactive ion etching (RIE) in Cl-based (CCl{sub 2}F{sub 2}/O{sub 2}) or organic-based (C{sub 2}H{sub 6}/H{sub 2}) discharges. The carrier loss is slightly more pronounced in the latter case, due possibly to the creation of deep level, compensating acceptors at greater depths as a result of implantation of the light hydrogen ions. Near-complete recovery of the initial carrier density occurs after annealing at 500 {degree}C for 30 s. Structural disorder is detected by ion channeling to depths of {similar to}400 A after C{sub 2}H{sub 6}/H{sub 2} RIE with a self-bias of 380 V. This disorder shows significant recovery after 400 {degree}C, 30 s annealing. Current-voltage measurements on Au Schottky diodes showed ohmic behavior after etching of the InP in a C{sub 2}H{sub 6}/H{sub 2} discharge, due to the nonstoichiometric surface remaining after RIE. Diodes fabricated on CCl{sub 2}F{sub 2}/O{sub 2} etched material show only a slight increase in reverse current compared to unetched control samples.
OSTI ID:
5489990
Journal Information:
Applied Physics Letters; (USA), Journal Name: Applied Physics Letters; (USA) Vol. 55:16; ISSN APPLA; ISSN 0003-6951
Country of Publication:
United States
Language:
English