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Effect of added acetylene on the rf discharge chemistry of C/sub 2/F/sub 6/. A mechanistic model for fluorocarbon plasmas

Journal Article · · J. Appl. Phys.; (United States)
DOI:https://doi.org/10.1063/1.327961· OSTI ID:5453578
The effect of added acetylene on the rf discharge chemistry of C/sub 2/F/sub 6/ was studied as a function of acetylene concentration. The principle products are HF, CF/sub 4/, CHF/sub 3/, C/sub 2/F/sub 4/, and CF/sub 2/ as determined by mass spectrometry. Under conditions typically used for etching SiO/sub 2/, residence time and power density control the amount of conversion of feed gas to products. Large amounts of polymeric material, with composition (CF)/sub n/, are formed in the discharge zone. A chemical model for fluorocarbon discharges is proposed, which assumes an equilibrium between dissociation and recombination of fluorocarbon fragments and fluorine atoms. Polymerization and selective etching of Si and SiO/sub 2/ in fluorocarbon dishcarges containing oxygen or hydrogen additives is interpreted in terms of the proposed model.
Research Organization:
Bell Laboratories, Murray Hill, New Jersey 07974
OSTI ID:
5453578
Journal Information:
J. Appl. Phys.; (United States), Journal Name: J. Appl. Phys.; (United States) Vol. 51:5; ISSN JAPIA
Country of Publication:
United States
Language:
English