TEM-APFIM investigation of boron-doped Ni/sub 3/Al

Conference · Tue Jan 01 04:00:00 EST 1985

OSTI ID:5446910

Horton, J A; Miller, M K

Boron additions to normally brittle Ni/sub 3/Al result in room temperature ductilities over 50%. Little is presently known about the role of boron in strengthening the otherwise brittle grain boundaries. A TEM structural characterization of cast material shows a featureless microstructure while rapidly solidified material has substantial aluminum enrichments coupled with a bimodal APB distribution. Preliminary atom probe investigations of cast material found the boron in solution, with no evidence of clustering in the grain interiors. A small enrichment of boron was found at twin boundaries.

• Research Organization: Oak Ridge National Lab., TN (USA)
• DOE Contract Number: AC05-84OR21400
• OSTI ID: 5446910
• Report Number(s): CONF-850788-1; ON: DE85017154
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360102* -- Metals & Alloys-- Structure & Phase Studies
ALLOYS
ALUMINIUM ALLOYS
BORON ADDITIONS
BORON ALLOYS
CASTING
COOLING
CRYSTAL STRUCTURE
ELECTRON MICROSCOPY
FABRICATION
ION MICROSCOPY
MICROSCOPY
MICROSTRUCTURE
NICKEL ALLOYS
NICKEL BASE ALLOYS
SPLAT COOLING
TRANSMISSION ELECTRON MICROSCOPY