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Thin films of silicon on metallurgical silicon substrates. Final report, 1 September 1976-30 September, 1979

Technical Report ·
DOI:https://doi.org/10.2172/5416331· OSTI ID:5416331

The principal approach used in this work is the deposition of a silicon film of controlled thickness and dopant distribution on a purified metallurgical silicon substrate. Efforts have been directed to (1) the purification of metallurgical silicon, (2) the preparation of metallurgical silicon substrates, (3) the deposition and characterization of silicon films on metallurgical silicon substrates, (4) the properties of polycrystalline silicon p-n junctions on metallurgical silicon substrates, (5) the fabrication and characterization of silicon solar cells on purified metallurgical silicon substrates, (6) the investigation of stability of thin film polycrystalline silicon solar cells, and (7) the reduction of the electrical effects of grain boundaries. A number of significant results have been obtained. Metallurgical silicon has been purified by a low cost technique, acid-extraction and phosphorus pentoxide treatment, to yield materials suitable for substrate purposes. Recrystallization techniques have been developed to produce large grain silicon sheet supported on graphite. Silicon films of controlled thickness and dopant distribution have been deposited on metallurgical silicon substrates, and the properties of silicon films and epitaxial p-n junctions have been investigated in detail. Polycrystalline silicon solar cells have been fabricated, and their properties including current-voltage characteristics, spectral response, minority carrier diffusion length, dopant profile, and stability, have been characterized in detail. The properties of grain boundaries in polycrystalline silicon solar cells have been investigated by photoresponse scan and EBIC techniques.

Research Organization:
Southern Methodist Univ., Dallas, TX (USA)
OSTI ID:
5416331
Report Number(s):
SAN-1285-T2
Country of Publication:
United States
Language:
English