Evaluation of the metal/adhesive interfaces in the MC2370 fire set

Conference · Wed Oct 01 00:00:00 EDT 1997

OSTI ID:538064

Zavadil, K R

Several analysis methods have been applied to evaluate the structure and composition of the electrode/adhesive interfaces i previously fielded M2370 Fire Sets. A method of interfacial fracture at cryogenic temperatures as been employed to expose regions of these interfaces at multiple levels in a SFE stack. Electron microscopy shows that bond failure induced by the fracture is predominantly adhesive with an equal probability of failure of the Au and Cu interfaces. Some evidence for cohesive, indicative of a possible microstructure related to electrical breakdown. Pinhole-free larger regions of adhesive also exist which may explain the observed high resistance in impedance measurements.

• Research Organization: Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 538064
• Report Number(s): SAND-97-2460C; CONF-970982-; ON: DE98000382; TRN: 97:005489
• Resource Relation: Conference: 21. aging, compatibility, and stockpile stewardship conference, Albuquerque, NM (United States), 30 Sep - 2 Oct 1997; Other Information: PBD: 1997
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
SILICONES
MICROSTRUCTURE
COPPER
GOLD
INTERFACES
DIELECTRIC MATERIALS
ELECTRIC CONDUCTIVITY
ADHESIVES
ELECTRODES
CRACKS