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Thin film adhesion and deadhesion

Conference ·
OSTI ID:6303273
A practical definition of good adhesion is that the interfacial region (or nearby material) does not fail under service conditions nor at unacceptably low stress levels under test conditions. Adhesion is a macroscopic property of the system and the failure of adhesion or deadhesion involves failure of large areas of material the surfaces of which rarely separate at a sharp boundary between two materials. The energy necessary to cause deadhesion may be likened to the fracture energy in the fracture of bulk materials. Good adhesion is prompted by: (1) strong bonding in the interfacial region, (2) absence of high stresses, (3) absence of easy fracture modes, and (4) no long-term degradation modes. Each of these factors may be influenced by the materials involved, the deposition method used, the deposition parameters and the service/test conditions. This paper will review a number of factors which determine the adhesion of film-substrate systems and will attempt to outline some methods for resolving adhesion problems.
Research Organization:
Sandia National Labs., Albuquerque, NM (USA)
DOE Contract Number:
AC04-76DP00789
OSTI ID:
6303273
Report Number(s):
SAND-81-0590C; CONF-811029-1; ON: DE81028415
Country of Publication:
United States
Language:
English

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