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U.S. Department of Energy
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Fracture toughness of silicon nitride-silicon nitride joints bonded with oxynitride glass

Conference ·
OSTI ID:5369851
An investigation into the feasibility of using oxynitride glass as the bonding material to join silicon nitride was undertaken. Two characteristics of these glasses were the basis for their selection. First, their compatibility with silicon nitride as evidenced by their existence as a grain boundary phase. Second, property changes with nitrogen additions suggest higher temperature capabilities with respect to oxide glass. This communication reports the room temperature fracture toughness of silicon nitride joined with oxynitride glass. 10 refs., 12 figs., 5 tabs.
Research Organization:
EG and G Idaho, Inc., Idaho Falls (USA)
DOE Contract Number:
AC07-76ID01570
OSTI ID:
5369851
Report Number(s):
EGG-M-06086; CONF-8704271-1; ON: DE88005548
Country of Publication:
United States
Language:
English