Automatic visual inspection of hybrid microcircuits
An automatic visual inspection system using a minicomputer and a video digitizer was developed for inspecting hybrid microcircuits (HMC) and thin-film networks (TFN). The system performed well in detecting missing components on HMCs and reduced the testing time for each HMC by 75%.
- Research Organization:
- Bendix Corp., Kansas City, MO (USA)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 5311636
- Report Number(s):
- BDX-613-2359
- Country of Publication:
- United States
- Language:
- English
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